Quantifying flux residues after soldering on technical copper using ultraviolet visible (UV-Vis) spectroscopy and multivariate analysis

dc.contributor.author	Stiedl, Jan
dc.contributor.author	Chassé, Thomas
dc.date.accessioned	2022-01-31T08:13:14Z
dc.date.available	2022-01-31T08:13:14Z
dc.date.issued	2021
dc.identifier.issn	1872-941X
dc.identifier.uri	http://hdl.handle.net/10900/123662
dc.language.iso	en	de_DE
dc.publisher	Pergamon - Elsevier Science Ltd	de_DE
dc.relation.uri	http://dx.doi.org/10.1016/j.microrel.2021.114367	de_DE
dc.subject.ddc	530	de_DE
dc.subject.ddc	540	de_DE
dc.subject.ddc	600	de_DE
dc.title	Quantifying flux residues after soldering on technical copper using ultraviolet visible (UV-Vis) spectroscopy and multivariate analysis	de_DE
dc.type	Article	de_DE
utue.quellen.id	20211125174918_00424
utue.personen.roh	Englert, Tim
utue.personen.roh	Stiedl, Jan
utue.personen.roh	Green, Simon
utue.personen.roh	Jacob, Timo
utue.personen.roh	Chasse, Thomas
utue.personen.roh	Rebner, Karsten
dcterms.isPartOf.ZSTitelID	Microelectronics Reliability	de_DE
dcterms.isPartOf.ZS-Issue	Article 114367	de_DE
dcterms.isPartOf.ZS-Volume	125	de_DE
utue.fakultaet	07 Mathematisch-Naturwissenschaftliche Fakultät	de_DE