| Author: | Böttge, Bianca; ... | |
| Tübinger Autor(en): |
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| Issue year: | 2018 | |
| Verlagsangabe: | In: IEEE 68th Electronic Components and Technology Conference, ECTC 2018, 29 May - 1 June 2018, San Diego, California. Proceedings: Piscataway, NJ: IEEE, 2018, S. 1258–1269. | |
| Language: | English | |
| Full text: |
https://doi.org/10.1109/ECTC.2018.00194 |
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| ISSN: | 2377-5726 | |
| ISBN: | 978-1-5386-4999-2 | |
| DDC Classifikation: |
500 - Natural sciences and mathematics 550 - Earth sciences 600 - Technology 620 - Engineering and allied operations 621.3 - Electric, electronic, magnetic, communications, computer engineering; lighting |
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| Keywords: | Verkapselung , Leistungselektronik , Zuverlässigkeit , Keramik , Verbundwerkstoff , Zement | |
| Dokumentart: | ConferenceObject | |
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