Transfer, Assembly, and Embedding of Small CMOS-Die Arrays for the Build-Up of Flexible Smart Implants
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Author:
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Heid, Andreas; de Andrade, Marcio Camoleze; Bleck, Lena; von Metzen, Rene P.; Kern, Dieter; Giehl, Juergen; Bucher, Volker
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Tübinger Autor(en):
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Published in:
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IEEE Transactions on Components Packaging and Manufacturing Technology
(2019), Bd.
9,
H.
7,
S.
1415-1425
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Verlagsangabe:
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IEEE - Inst Electrical Electronics Engineers Inc
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Language:
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English
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Full text:
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http://dx.doi.org/10.1109/TCPMT.2019.2900564
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ISSN:
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2156-3985
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DDC Classifikation:
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600 - Technology
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Dokumentart:
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Article
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