Transfer, Assembly, and Embedding of Small CMOS-Die Arrays for the Build-Up of Flexible Smart Implants
Author:
|
Heid, Andreas; de Andrade, Marcio Camoleze; Bleck, Lena; von Metzen, Rene P.; Kern, Dieter; Giehl, Juergen; Bucher, Volker
|
Tübinger Autor(en):
|
|
Published in:
|
IEEE Transactions on Components Packaging and Manufacturing Technology
(2019), Bd.
9,
H.
7,
S.
1415-1425
|
Verlagsangabe:
|
IEEE - Inst Electrical Electronics Engineers Inc
|
Language:
|
English
|
Full text:
|
http://dx.doi.org/10.1109/TCPMT.2019.2900564
|
ISSN:
|
2156-3985
|
DDC Classifikation:
|
600 - Technology
|
Dokumentart:
|
Article
|
Show full item record
|